Electromagnetic Compatibility & Signal Integrity

‌Dr. Thomas Van Doren

Professor Emeritus, Missouri S&T

Electrical & Computer Engineering

 

Dr. Van Doren has conducted research and education in electromagnetic compatibility for the past 30 years. More than 19,000 engineers and technicians from 105 companies and government agencies have attended his Grounding and Shielding and Circuit Board Layout courses.

Circuit Board Layout to Reduce Noise Emission and Susceptibility

A One-Day Lecture/Demonstration Presentation

Prerequisites: Persons taking this course should have taken Dr. Van Doren’s 2-day course on “Grounding and Shielding” or should have some prior knowledge of EMC principles.

Cost and Scheduling: The total costs for this 1-day course is $9,800, for a maximum of 35 participants; or $7,000 for a maximum of 20 participants. This price includes all travel expenses in the continental U.S. and one copy of the course notes per participant. Please email Tom Van Doren at vandoren@mst.edu or call him at 573-578-4193 to schedule an in-house presentation.


  • Course Outline
  • Course Objectives

Course Outline

                                     

1. The Causes of Circuit Board EMC & SI Problems
2. It’s ALL About Controlling the Current Path
3. Transmission Line Effects
4. Noise Coupling Mechanisms, Unintended Antennas,¿ and Diagnostic Techniques

                           

5. Filtering Conducted Noise
6. Grounding to Reduce Noise
7. DC Power Distribution and Decoupling

 

Course Objectives

                                               

1. Explain why wiring inductance is more important than resistance.
2. Describe how current loop area is related to self-inductance.
3. Explain how resonances worsen circuit board emission and immunity.
4. Determine which nets should be terminated as transmission lines.
5. Describe the four noise-coupling mechanisms.
6. Describe two ways to reduce each of the four coupling mechanisms.
7. Explain the two reasons for grounding.

                                               

8. Explain the difference between a grounding conductor and a routing conductor.
9. Explain why and how to ground a signal to an external metal enclosure.
10. Explain when to use series blocking and when to use shunt diverting filter techniques.
11. Understand the problem caused by mutual inductance between the input and output loops of shunt capacitor filters.
12. Recognize trace layouts that have excessive inductance.
13. Design more effective DC power distribution busses.
14. Understand the advantages of alternative layer stackup configurations.




Questions?

Contact Us

Registration Contact:

Dr. Thomas Van Doren
Missouri S&T
Electrical & Computer Engineering
EMC Lab
Rolla, MO  65409
Phone: 573-578-4193
Email: vandoren@mst.edu